Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Nvidia has secured a dominant share of the world’s most advanced chip packaging capacity, concentrating its supply chain around a small number of overseas partners even as U.S. government efforts to ...

The facility will use advanced packaging technologies to combine multiple chips into single packages for AI applications.

Google may use Intel Foundry’s EMIB packaging for TPUv8e, boosting Intel’s AI chip ambitions and reshaping advanced ...

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...

Modern artificial intelligence chips, such as those made by Nvidia, are not single chips but several chips glued together ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

This AI infrastructure leader could prove to be an exceptional pick in the long run.

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end ...

SK Hynix announces $13B South Korea plant for HBM chip packaging targeting AI data centers, with construction starting April ...