The NanoIC pilot line, a European initiative coordinated by imec, has expanded its process design kit portfolio with the release of two new PDKs aimed at semiconductor technologies beyond the 2nm node ...

KYOTO, Japan — Toshiba Corp. came to Kyoto, Japan's VLSI Technology Symposium with a 100-nanometer (0.10-micron) system-on-chip (SoC) technology that supports embedded DRAM and mixed-signal ...

TOKYO, Japan, December 9, 2010 — Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced the development of a basic structure for ...

IBM eDRAM test chip. IBM announced a major breakthrough in microchip design that will more than triple the amount of memory contained on a single high-end chip. With the advent of multi-core chips, ...

As an SoC process, embedded DRAM (eDRAM) has never quite lived up to its potential. NEC Electronics Inc. is trying to change that by introducing an eDRAM structure designed to eliminate the ...

“AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption.

Debuting as two unique technologies for the manufacture of 40-nm system-on-chip (SoC) devices with embedded dynamic random access memory (eDRAM), the UX8GD eDRAM technology registers clock speeds up ...

When it comes to executing algorithms in DSP applications, you can never have enough performance. At least that's what designers at Analog Devices must have felt when they collaborated with IBM ...

According to this press release, Microsoft is using an embedded DRAM design from NEC in the ATI-developed graphics processing unit of the Xbox 360. KAWASAKI, Japan and SANTA CLARA, Calif. and ...

But even with the advancements in DRAM, the announcement is expected to bolster IBM's relationship with Advanced Micro Devices and be a sharp stick in the eye to Intel. Named eDRAM -- for embedded ...