Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

If you’re working on standard-cell libraries at 28 nm or below, you already know the math isn’t in your favor. At the 130 nm ...

Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has ...

Precision Time Measurement; blockchain-based traceability; simulation in space; 6G PHY co-design.

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...

Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging Intel Vs. Samsung Vs. TSMC Hybrid Bonding Makes Strides Toward Manufacturability 3.5D: The Great Compromise ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

As chips become more complex and packaging options multiply, designers have more choices than ever for connecting system ...

Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging ...

In-Depth Semiconductor Engineering published the Manufacturing, Packaging & Materials newsletter this week, with these top stories: With Chiplets, What Role Does Economics Play? Low-Temp Solders Are ...